RamenPanda
RamenPanda
"MI550 is positioning to challenge Rubin Ultra in 2H27. AMD's 2.5D/3D packaging expertise enables a 4-die/12 HBM4e design, vs Rubin Ultra 2-die package (and MCM for 2 sets of 2-die)." Given that high-capacity HBM4E Rubin Ultra has been delayed, I think MI550 can realistically

Jukan

"MI550 is positioning to challenge Rubin Ultra in 2H27. AMD's 2.5D/3D packaging expertise enables a 4-die/12 HBM4e design, vs Rubin Ultra 2-die package (and MCM for 2 sets of 2-die)." Given that high-capacity HBM4E Rubin Ultra has been delayed, I think MI550 can realistically

Jukan
From X

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