Chris Lee
Chris Lee
The TSMC chart shows their System-on-Wafer (SoW) tech scaling up interposers massively. By 2026: ~12 HBM stacks per substrate. By 2029: 64 HBM stacks (5x jump). It means next-gen Al accelerators/GPUs will pack way more high-bandwidth memory. Demand for HBM/DRAM (and $MU , $TSM ) keeps exploding—not peaking. Al hardware is just ramping.
Trade Whisperer
Trade Whisperer @TradexWhisperer · 
$MU $DRAM $TSM Holy Shit 2026: 12 HBM stacks per substrate 2029: 64 HBM stacks with SoW That is a 5x structural expansion of HBM demand per system. The memory content per platform is not peaking. It is just getting started. https://t.co/5GIM9aViFP
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Disclaimer: The above content reflects only the author's opinion and does not represent any stance of CoinNX, nor does it constitute any investment advice related to CoinNX.

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